| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve a semiconductor device in reliability by a method wherein solder is prevented from adhering to a semiconductor chip except its electrode. SOLUTION: A semiconductor chip 6 is soldered on the top surface of a lead terminal 3, a step 2aa formed by bending an auxiliary lead terminal 2 at a narrow part 2a is soldered to the upper electrode of the semiconductor chip 6 avoiding coming into contact with the oxide film of the semiconductor chip 6, and the auxiliary lead terminal 2 is soldered to a lead terminal 4.</p> |
