发明名称 ELECTRONICS COOLING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To reduce the cost of electronics cooling structure and to effectively utilize the heat generated in the enclosure of electronics. SOLUTION: A cooling structure for electronics is provided with an enclosure 2 for electronics incorporating electronic components 43 and having an air flow-out port 2a opened inside and outside the enclosure 2, a cooling fan 44 which is set up in the enclosure 2 for discharging heat generated from the parts 3 to the outside via the port 2a, and a displacer cylinder 4 which is connected to the fan 44 via a crank shaft 7 and the internal pressure of which is fluctuated by the temperature fluctuation due to the advancing-retreating movements of a displacer piston 5. The structure is also provided with a Stirling engine 3, having a power piston 6 which is moved forwards and backwards by the pressure fluctuation in the cylinder 4. One end section of the engine 3 in the axial direction of the cylinder 3 is positioned inside the enclosure 2, and the other end section is positioned outside the enclosure 2.
申请公布号 JP2001127477(A) 申请公布日期 2001.05.11
申请号 JP19990309194 申请日期 1999.10.29
申请人 NEC CORP 发明人 FUKUNAGA HIROAKI
分类号 H05K7/20;H01L23/467;(IPC1-7):H05K7/20 主分类号 H05K7/20
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