| 摘要 |
PROBLEM TO BE SOLVED: To provide a fast test device for a bare chip LSI mounting board capable of detecting, in its early stages, continuity defectives or functional defectives and reducing the loss in production in the stage of mounting a bare chip LSI on a board before mounting SMT components such as a RAM, a capacitor, and resistance. SOLUTION: In the stage of mounting a bare chip LSI on a board, tester boards on which components corresponding to SMT components such as a RAM, a capacitor, and resistance, are to be mounted are faced to each other, a probe of each component of the tester board corresponding to the SMT components is brought into contact with a pad in the SMT component mounting portion, a preliminary mounting state of the SMT components to the board is constituted, and in this state, a test signal is sent to the bard chip LSI from a fast test control part to realize a fast test. |
