| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting diode chip which can be mounted on a mounting substrate without tilting with good positioning accuracy and enables flip chip bonding with good position accuracy, and provide further its bump formation method. SOLUTION: The chip is provided with an n-type nitride semiconductor layer and a p-type nitride semiconductor layer formed on a substrate, an n side electrode and a p side electrode formed each on n type and p type nitride semiconductor layers and a bump formed each on an n side electrode and a p side electrode. Each bump is formed so that a plane configuration opposing a mounting substrate has a shake having a major axis in one direction and each ridge of the bumps in contact with the packaging substrate is on a substantially a straight line and positioned on the same plane. |
