MOLDING DEVICE AND MOLDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mold device and a molding method whereby voids and bubbles are not generated and a weld does not remain in an obtained molded item when an optical semiconductor element is molded with a molding resin. SOLUTION: A molding device 10 comprises a cavity 12 formed of a die with a top force and a bottom force for molding a molded item having a projection part locally and a gate 14 for injecting mold resin to the cavity 12. The molding device 10 is constituted by comprising a gate 30 for a recessed part for injecting mold resin to the cavity 12 comprising a recessed part 22 for molding a portion including a projection part of a molded item and a plate-like gate 28 for injecting mold resin to the cavity 12 for molding a portion without a projection part of a molded item like a plate.