发明名称 METHOD FOR INTERCONNECTING PRINTED WIRING BOARDS AND PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To align printed wiring boards having an electrode pattern of fine pitch easily and precisely and to secure the aligned printed wiring boards easily and surely. SOLUTION: An electrode pattern 13 of fine pitch is formed at the end of a printed board 10 and fitting patterns 11a, 11b are formed of the same material as the electrode pattern 13 in the vicinity thereof. An electrode pattern 23 of fine pitch is formed at the end of an FPC 20 being connected with the printed board 10 and patterns 21a, 21b being fitted to the fitting patterns 11a, 11b are formed of the same material as the electrode pattern 23 in the vicinity thereof. The electrode patterns 13 and 23 are connected electrically by fitting the pattern 11a to the pattern 21a and fitting the pattern 11b to the pattern 21b.
申请公布号 JP2001127424(A) 申请公布日期 2001.05.11
申请号 JP19990305676 申请日期 1999.10.27
申请人 FUJITSU LTD 发明人 IRIGUCHI SHIGEO;WATANABE SATOSHI;MURAOKA YOSHITAKA
分类号 H05K1/11;H05K1/14;H05K3/24;H05K3/34;H05K3/36;H05K3/40;(IPC1-7):H05K3/36;H01R12/06 主分类号 H05K1/11
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