| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor element housing package which is surely and excellently electrically connected to an outer circuit board and kept high in reliability. SOLUTION: The mounting structure of a semiconductor element housing package A has such a structure where connection terminals 5a that are not electrically connected to a semiconductor element 2 are arranged on a part of the rear of a ceramic insulating board 1 corresponding to the center of the semiconductor element 2 mounted on the surface of the board 1. |
