| 摘要 |
PROBLEM TO BE SOLVED: To enable a power resin-sealed semiconductor device to be realized, lessened in size, and provided with a large number of terminals. SOLUTION: A die pad 4 and signal connecting leads 5 surrounding the die pad 4 are held on a resin film 3. A semiconductor chip 11 is held on the die pad 4 through the intermediary of an adhesive agent 12, and the semiconductor chip 11 is connected to the signal connecting leads 5 with metal fine wires 13. The resin film 3, die pad 4, signal connecting leads 5, semiconductor chip 11, and metal fine wires 13 are sealed up in a resin package 14. A heat dissipating part 4a is provided on the die pad 4 protruding downward from the resin film 3, and terminal lands 6 are each provided on the signal connecting leads 5 protruding downward from the resin film 3. |
