| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a board equipped with an Au layer formed on an Ni plating layer which is provided on the exposed part of a metal layer formed on a board main body, where discolorations induced in the Au plating layer can be removed. SOLUTION: A board 1 is equipped with electrode pads 5 as the exposed parts of a metal layer formed on a board main body 2, an NI plating layer 9 formed on the surface of the board main body 2, and an Au plating layer 10 formed on the Ni plating layer 9. Furthermore, the board 1 is equipped with solder bumps 12 and an reinforcing plate 14 bonded at a position surrounding the solder bumps 12. The method of manufacturing the board 1 comprises a bump masking process where a mask 15 is pasted on the reinforcing plate 14 covering the solder bumps 12 so as to prevent a pickling solution SJ from coming into contact with them and a pickling process where the board 1 is cleaned with a pickling solution SJ which contains hydrochloric acid.
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