发明名称 STRUCTURE FOR PACKAGE FOR PIEZOELECTRIC VIBRATOR AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To obtain a means that thins the thickness of a base of a vibrator package for cold press bonding or resistance welding. SOLUTION: Deep drawing is applied to a metallic plate to obtain a package, a flange for cold press bonding is formed to its opening, holes are made to a thick part of the bottom of the package and lead terminals are air-tightly penetrated through the holes by using a glass material to obtain the base.
申请公布号 JP2001127576(A) 申请公布日期 2001.05.11
申请号 JP19990301644 申请日期 1999.10.22
申请人 TOYO COMMUN EQUIP CO LTD 发明人 SOGA TADANAKA
分类号 H03H9/02;H03H3/02;H03H9/10;H03H9/19;(IPC1-7):H03H9/02 主分类号 H03H9/02
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