| 摘要 |
PROBLEM TO BE SOLVED: To prevent a crack from being generated in a ceramic substrate due to the difference in the thermal coefficient of expansion between the ceramic substrate and a metal circuit board. SOLUTION: In the ceramic circuit board where a metal circuit board 3 is mounted onto the upper surface of a ceramic substrate 1, a metallization layer 4 is arranged at a distance A inside the ceramic substrate 1 from the upper surface of the ceramic substrate 1 by a thickness of 1/3 of the ceramic substrate 1, and the outer periphery of the metallization layer 4 is set larger than that of the metal circuit board 3 by the distance A.
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