发明名称 PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To prevent a high-frequency signal from a lead terminal for signal from radiation leakage and obtain more efficient passing property with less loss of high-frequency signal. SOLUTION: This package is made of insulative material and is provided with an approximately rectangular parallelopiped container body 1 in which a metallic cover 2 is joined with an opening of the upper face and an optical semiconductor element 3 is housed inside, a cylindrical optical fiber fixing member 8 which is joined with a through hole provided on the first side wall of the container body 1, a lead terminal 6a for signal and lead terminals 6b and 6b for grounding on both sides thereof which are joined with a plurality of metallized layers 5a to 5c provided on the second side wall of the container body 1, extending downward along the side faces. The metallized layer 5b with which the lead terminals 6b and 6b are joined are formed surrounding the metallized layer 5a with which the lead terminal 6a is joined.
申请公布号 JP2001127371(A) 申请公布日期 2001.05.11
申请号 JP19990301684 申请日期 1999.10.22
申请人 KYOCERA CORP 发明人 YANAGISAWA MITSUO;NAKATANI SHINICHI
分类号 H01L23/02;H01L33/62;H01S5/022 主分类号 H01L23/02
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