METHOD FOR MANUFACTURING RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problems of reliability and surface mounting of a product caused by the fact that chipping or burring of resin takes place at the end part of a lead part in a package sealed on one side. SOLUTION: The lead part 4 of a resin sealed lead frame is cut, at the cutting part 5 thereof, from the bottom face side of the lead frame by means of a rotary blade 12. Both an inner lead part 4a and sealing resin 8 constituting a package are cut. Since the lead part 4 is cut together with the sealing resin 8, resin burrs are eliminated and warp due to the material is eliminated at the lead part 4. Consequently, the problems of reliability and surface mounting of a product can be eliminated.