发明名称 PASTE PRINTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a paste printing method in which the reliability of a filling step is enhanced by ensuring the quantity of paste filling a hole made in the basic material of a circuit board. SOLUTION: Under a condition where a circuit board is placed on a sheet 7 having a sheet material exhibiting high affinity to the organic components of paste 6 filling a hole 4 made in the basic material 3 of a circuit board, the hole 4 is filled with the paste 6.
申请公布号 JP2001127428(A) 申请公布日期 2001.05.11
申请号 JP20000269424 申请日期 2000.09.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIGASHIDA TAKAAKI;IWAKI TAKAHIKO;OTANI HIROYUKI;SATO SHOJI
分类号 B41F15/08;B41M1/12;H05K3/12;H05K3/40;(IPC1-7):H05K3/40 主分类号 B41F15/08
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