| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit device, where a semiconductor device has been packaged on a packaging substrate using an adhesive for packaging, that can reduce packaging time, has improved packaging reliability, and can be repaired, and its manufacturing method. SOLUTION: The integrated circuit device is provided with a packaging substrate where a wiring pattern is formed, and a semiconductor device that is bonded onto the packaging substrate while an external connection terminal is electrically connected to the wiring pattern. The semiconductor device is bonded to the packaging substrate by an adhesive being made of a resin composition containing an epoxy resin as a base resin and aromatic onium salt as a curing catalyst.
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