发明名称 METHOD FOR POSITIONING TERMINAL AND LAND
摘要 <p>PROBLEM TO BE SOLVED: To strictly prevent misalignment of a part, when the part is automatically mounted on a substrate, while soldering strength is improved. SOLUTION: A region 6 of the surface of a terminal body 2, where a land is jointed through a solder layer is provided with a notch 1. The surface tension of a molten solder, which takes place at a part contacting the notch 1 improves a positioning precision. Since a fillet is formed between the inside surface 7 of the notch 1 and the land, a soldering strength is improved.</p>
申请公布号 JP2001127419(A) 申请公布日期 2001.05.11
申请号 JP19990304098 申请日期 1999.10.26
申请人 NEC SAITAMA LTD 发明人 UMEZAWA ATSUSHI;UMEDA KOJI;KAWASHIMA NOBUHIRO
分类号 H05K3/34;(IPC1-7):H05K3/34;H01R12/32 主分类号 H05K3/34
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