| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a resin-sealed power semiconductor device which can be lessened in size and provided with a large number of terminals. SOLUTION: A die pad 4 and signal connecting leads 5 surrounding the die pad 4 are held on a resin film 3. A semiconductor chip 11 is held on the die pad 4 through the intermediary of an adhesive agent 12 and connected to the signal connecting lead 5 with metal fine wires 13. The film 3, die pad 4, signal connection leads 5, semiconductor chip 11, and metal fine wires 13 are sealed with a resin package 14. A heat dissipating part 4a is provided to the die pad 4 protruding under the resin film 3 so as to form a first recess 4b, and as terminal land 6 is provided in each of the signal connection leads 5 protruding under the resin film 3 so as to form a second recess 5b.</p> |
