STRUCTURE AND METHOD FOR MOUNTING MICRO-FABRICATION SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure for micro-fabrication sensor which uses a general inexpensive resin substrate as a substrate, does not cause any high step for wire bonding, and can absorb the stress caused by a difference in thermal expansion. SOLUTION: In a mounting structure for mounting a micro-fabrication sensor 1 on a substrate 14, the sensor 1 is mounted on the upper surface of a base 10 through which vertical wiring 11 for connecting the upper and lower surfaces of the base 10 to each other is formed and on which bumps 12 which are formed in contact with the wiring 11 are formed and the signal outputting terminal section 7 of the sensor 1 is connected to the electrode section 13 of the wiring 11 positioned above the base 10 by wire bonding 8. In addition, the base 10 mounted with the sensor 1 is mounted on a substrate 14.