| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance machining efficiency for cutting a board into segments and to enhance machining efficiency of a cutter while suppressing consumption thereof. SOLUTION: A plurality of circuit boards 10a, each having a semiconductor element 12 mounting part on one side thereof, are formed integrally and grooves 30 are made in the other side thereof at positions for sectioning respective circuit boards 10a. At each element mounting part of such a board 10, a semiconductor element 12 is mounted and the board 10 is sealed with resin 14 on the side mounting the semiconductor element. Subsequently, the resin sealed board 10 is abutted, on the other side thereof, against a support 32 and the edge of a cutter 40 is moved from the resin sealed side of the board 10 into an air gap surrounded by the support 32 and the groove 30 along the groove in order to cut the sealing resin 14 and the board 10 thus obtaining a segmented semiconductor device.</p> |
