发明名称 WIRING PARTS AND WIRING SUBSTRATE PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide wiring parts with structure that has high shielding properties and at the same time can be manufactured easily, and a wiring substrate product that mounts the parts. SOLUTION: Wiring parts 41 are provided with first and second end faces 30 and 32. Also, the wiring parts 41 are provided with a first insulation layer 38 having a reference surface being extended in a direction for orthogonally crossing the first and second end faces 30 and 32, a second insulation layer 42 that is provided along a reference surface for reaching the first and second end faces 30 and 32, a wiring part 44 that has one end being provided on the first end face 30 and the other end being provided on the second end face 32 and connects both the ends while passing on the second insulation layer 42, a third insulation layer 46 for covering the wiring part 44 while it is provided along the reference surface, a first conductor layer 48 that is provided on the third insulation layer 46, and a second conductor layer 40 that is provided between the first insulation layer 38 and the second insulation layer 42.
申请公布号 JP2001127391(A) 申请公布日期 2001.05.11
申请号 JP19990307168 申请日期 1999.10.28
申请人 TAIHEIYO CEMENT CORP;ZEFIRUSU:KK 发明人 ISHIKAWA KATSUYUKI;SUGANO OSAMU;TSUKAMOTO KEIZO;KAYAHARA ATSUSHI;TAKAHASHI SHIGERU
分类号 H01R11/01;H05K1/02;H05K1/11;H05K1/18;(IPC1-7):H05K1/11 主分类号 H01R11/01
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