METHOD AND JIG FOR SOLDERING PIN TO PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To develop a method, applicable to mass production, for soldering pins onto a multilayer circuit board having a micro circuit at high density using a prior art reflow furnace. SOLUTION: In order to enhance absorption of infrared and far infrared, surface of a printed board is subjected to blackening. When the material of the printed board is aluminum or aluminum based alloy, blackening is effected by anode oxidation.