发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To prevent degradation of reliability as much as possible. SOLUTION: A semiconductor device is provided with a semiconductor substrate 2 comprising an element formation region and an element separation region, a transistor comprising gate electrodes 5, 6, 7, and 8 formed in the element region of the semiconductor substrate as well as a diffusion layer 9 formed in the element regions on both sides of the gate electrode, and a barrier insulating film 12 formed above the substrate except for the region near the gate electrode of the transistor.
申请公布号 JP2001127273(A) 申请公布日期 2001.05.11
申请号 JP19990303726 申请日期 1999.10.26
申请人 TOSHIBA CORP 发明人 SHIRATA RIICHIRO;ARITOME SEIICHI;AIDA AKIRA;KAMIYA EIJI;IIZUKA HIROHISA;TSUNODA HIROAKI;MEGURO TOSHITAKA;KOIDO NAOKI
分类号 H01L21/8247;H01L21/76;H01L21/762;H01L27/08;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/115;H01L21/824 主分类号 H01L21/8247
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