| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip packaging structure, which is formed easily and is low in cost, is excellent in an environmental resistance and can reduce the mounting area of a semiconductor chip, and to provide the manufacturing method of the packaging structure. SOLUTION: A base for mounting a semiconductor chip 5 on its surface is a glass base 1 filled with metal wires 2, the metal wires 2 are used as lead wires and a cover part (silicon substrate 7) for sealing a semiconductor chip 5 mounting part on the surface of the base 1 is bonded to the base 1. |
