METHOD FOR MANUFACTURING WIRING BOARD WITH METAL PLATE

摘要

PROBLEM TO BE SOLVED: To improve the adhesion property between a wiring substrate and a metal plate. SOLUTION: After a wiring board 2 and a metal plate 4 are laminated via an adhesion layer 3 and then are exposed to reduced pressure atmosphere, they are bonded under pressurized atmosphere, where the atmospheres are achieved, for example, in a pressure vessel.