| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that resin spreads up to an undesired region when it is irradiated with plasma in order to enhance adhesion. SOLUTION: In a semiconductor device comprising a semiconductor pellet and a wiring board connected electrically while facing each other and boded through resin, a region slightly inside of the outer circumference of the wiring board is irradiated with plasma and resin is placed in the plane irradiated with plasma. A plurality of scribing lines on an insulating board are covered with a mask and a region exposed to the mask opening, including the conductive pads on the wiring board, is irradiated with plasma. |
