| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board exhibiting excellent machinability with UV-laser being used for making a via contact hole. SOLUTION: A multilayer printed wiring board comprises a board having an inner layer circuit, an insulation resin layer formed thereon, and an outer layer circuit formed on the insulation resin layer wherein via holes for connecting the inner layer circuit electrically with the outer layer circuit are made by UV-laser irradiation. In the insulation resin layer, resin component is mixed with 0.1-5 wt.% of benzotriazole based UV-ray absorbing material. |
