| 摘要 |
PROBLEM TO BE SOLVED: To enable terminals joined to an insulating board to be enhanced in bonding strength and density and a protective cap to be improved in hermetic sealing, in a packaged hybrid integrated circuit device which is obtained by packaging the insulating board mounted with an electronic part on the front with the protective cap. SOLUTION: Lead terminals b3 and b4 are densely provided to the side edge faces of an insulating board A, the tips of the lead terminals b3 and b4 are bent on the front surface of the insulating board A and connected to a printed wiring, and the insulating board A is inserted into a protective cap D making its surface confront the inside of the protective cap D and all its edge faces come into close contact with the inner circumference of the opening of the protective cap D. Grooves D2 where the lead terminals b3 and b4 are fitted are provided to the corresponding part of the inner circumference of the opening of the protective cap D.
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