| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part package which is capable of sealing a ceramic board well with a lid. SOLUTION: A metallized layer 10 is composed of a first metallized pattern 11 provided to the edge of the plate member of a frame member 5 and a second metallized pattern 12 provided to the outer edge 11a of the frame member of the first metallized pattern 11. The second metallized pattern 12 is provided to the outer edge 11a of the first metallized pattern 11, and the outer edge of the metallized layer 10 gets thicker than its center. A lid member 3 is provided on a joining member 15. The second metallized pattern 12 is partially provided to the outer edge 11a of the first metallized pattern 11 by which a ceramic board 2 can be more firmly bonded to the metallized layer 10, and the ceramic board 2 mounted with an electronic part 100 is hermetically sealed with the lid member by which the ceramic part 100 can be made to operate normally and stably for a long term.
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