发明名称 |
Semiconductor device comprises a region of a first conducting type formed on the surface of a semiconductor substrate, an element-forming region, a semiconductor element, an insulation film and a contact hole |
摘要 |
The semiconductor element has an electrode part (4a), a pair of first impurity regions; and second impurity regions. Semiconductor device comprises a first region (2a) of a first conducting type formed on the surface of a semiconductor substrate; an element-forming region which is divided on the surface by an element insulation film (3) and is formed on the surface of the region of the first conducting type; a determined semiconductor element formed on the element-forming region; an insulation film (11) formed on the substrate to cover the semiconductor element; and a first contact hole (12c) in the insulation film to expose the surface of the element-forming region. Preferred Features: The insulation film is made of silicon oxide. The impurity is phosphorus or boron.
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申请公布号 |
DE10019708(A1) |
申请公布日期 |
2001.05.10 |
申请号 |
DE20001019708 |
申请日期 |
2000.04.20 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO |
发明人 |
ASHIDA, MOTOI;KAMITANI, YOSHIKAZU;HAMASUNA, EIJI |
分类号 |
H01L21/8238;H01L21/8244;H01L27/092;H01L27/11;(IPC1-7):H01L27/11 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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