发明名称 Semiconductor device comprises a region of a first conducting type formed on the surface of a semiconductor substrate, an element-forming region, a semiconductor element, an insulation film and a contact hole
摘要 The semiconductor element has an electrode part (4a), a pair of first impurity regions; and second impurity regions. Semiconductor device comprises a first region (2a) of a first conducting type formed on the surface of a semiconductor substrate; an element-forming region which is divided on the surface by an element insulation film (3) and is formed on the surface of the region of the first conducting type; a determined semiconductor element formed on the element-forming region; an insulation film (11) formed on the substrate to cover the semiconductor element; and a first contact hole (12c) in the insulation film to expose the surface of the element-forming region. Preferred Features: The insulation film is made of silicon oxide. The impurity is phosphorus or boron.
申请公布号 DE10019708(A1) 申请公布日期 2001.05.10
申请号 DE20001019708 申请日期 2000.04.20
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO 发明人 ASHIDA, MOTOI;KAMITANI, YOSHIKAZU;HAMASUNA, EIJI
分类号 H01L21/8238;H01L21/8244;H01L27/092;H01L27/11;(IPC1-7):H01L27/11 主分类号 H01L21/8238
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