发明名称 SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR ELEMENTS ARRANGED SIDE BY SIDE AND PROVIDED WITH HOLLOW COOLING BODIES
摘要 A semiconductor device comprises semiconductor elements arranged side by side and provided with hollow cooling bodies. The cooling bodies are joined to each other by a connection conduit for the coolant which is flexible and which insulates the cooling bodies from each other electrically. The connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
申请公布号 US3703668(A) 申请公布日期 1972.11.21
申请号 USD3703668 申请日期 1971.07.09
申请人 ALLMANNA SVENSKA ELEKTRISKA AB. 发明人 PER-AKE BYLUND;TIBOR FARKAS;NILS ERIC ANDERSSON
分类号 H01L23/473;H01L25/03;(IPC1-7):H01L3/00;H01L5/00 主分类号 H01L23/473
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