发明名称 |
SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR ELEMENTS ARRANGED SIDE BY SIDE AND PROVIDED WITH HOLLOW COOLING BODIES |
摘要 |
A semiconductor device comprises semiconductor elements arranged side by side and provided with hollow cooling bodies. The cooling bodies are joined to each other by a connection conduit for the coolant which is flexible and which insulates the cooling bodies from each other electrically. The connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
|
申请公布号 |
US3703668(A) |
申请公布日期 |
1972.11.21 |
申请号 |
USD3703668 |
申请日期 |
1971.07.09 |
申请人 |
ALLMANNA SVENSKA ELEKTRISKA AB. |
发明人 |
PER-AKE BYLUND;TIBOR FARKAS;NILS ERIC ANDERSSON |
分类号 |
H01L23/473;H01L25/03;(IPC1-7):H01L3/00;H01L5/00 |
主分类号 |
H01L23/473 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|