| 摘要 |
The invention concerns a method for making an optical semiconductor housing and an optical semiconductor housing, wherein the front face of a first semiconductor component (4) such as microprocessor is fixed on a rear face of an electrical connection support plate (30), first electrical connection means (7) connect said first component to said support plate, the rear face of a second semiconductor component (19) is borne by said support plate, its front face comprising an optical sensor (21), second electrical connection means (22) connect said optical component to said support plate, said first component (4) is encapsulated in a coating block (15), an encapsulating wall projecting (17) on the front face of said support plate defines a cavity (18) at the bottom of which is arranged said optical component (19), a cover is fixed on the front end of said projecting wall and at least partly transparent, and external electrical connection means (28) arranged on an exposed part of said support plate. |
