摘要 |
<p>A process for the etching of multiple layers of at least two different metals comprises forming a resist pattern over a first layer of metal, applying a first etch solution onto said resist pattern so that at least some etch solution contacts exposed areas of the first layer of metal, applying a second etch solution onto the resist pattern the second etch solution having a rate of etch that is less than the rate of etch of the first etch solution, and applying a third etch solution to the etched first metal layer, the third etch solution having a faster rate of etch towards the second metal than towards the first metal to etch into said second metal layer. The use of hardenable (polymerizable, curable, dryable) polymeric material on the first and second etched metal layers provides significant advantages in use of the etched materials.</p> |
申请人 |
BMC INDUSTRIES, INC. |
发明人 |
WHITEHURST, DONALD, A.;WYATT, PAUL, D.;RING, CHARLES;DUFRESNE, MICHAEL, J.;BRENES, JOSE, F.;FINGER, BRUCE, A.;ZEIPELT, DAVE;BORNING, JEFFREY, M.;MATTSON, DENNIS, D. |