| 摘要 |
<p>In a printed circuit board comprising a track pattern (L1) and a substrate (DP), an additional layer (L3) of copper is provided, which is electrically insulated from the track pattern by a layer of an insulating material (L2). Both these layers (L2, L3) are situated between the track pattern (L1) and the substrate (DP). During operation of a circuit obtained by making use of the printed circuit board, the additional layer (L3) serves as a heat spreader, resulting in an efficient transport of the heat generated by components (C1, C2) in the circuit.</p> |
