AQUEOUS DISPERSION FOR FORMING CONDUCTIVE LAYER, CONDUCTIVE LAYER, ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

An aqueous dispersion of the invention in which conductive particles and organic particles are dispersed in an aqueous medium is used for forming a conductive layer having a volume resistivity of, for example, 10<-4> OMEGA =.cm or less by electrodeposition. A circuit board of the invention comprises an insulating layer and a conductive layer including a through conductive part extending through the conductive layer and is manufactured preferably by a method of the invention. The method comprises the steps of closing one mouth of a through hole made in the insulating layer with a piece of conductive foil and electrodepositing a conductive layer using a dispersion of the invention as the electrodeposition liquid and the conductive foil as one electrode. A multilayer wiring board of the invention comprises a core wiring sheet having sheet wiring layers connected to each other and formed on both sides of the sheet, an insulating layer formed on at least one of the sides of the sheet, a wiring layer formed thereon, and an interlayer short-circuiting part electrically connecting the wiring layer to the sheet wiring layer and extending through the insulating layer. The interlayer short-circuiting part is a conductor formed by electrodeposition using the dispersion as the electrolyte. Since the conductive layer or conductor is formed by electrodeposition, the productivity and connection reliability are high.