发明名称 |
INTER-CIRCUIT ENCAPSULATED PACKAGING FOR POWER DELIVERY |
摘要 |
An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanica l coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.
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申请公布号 |
CA2389712(A1) |
申请公布日期 |
2001.05.10 |
申请号 |
CA20002389712 |
申请日期 |
2000.10.24 |
申请人 |
INCEP TECHNOLOGIES, INC. |
发明人 |
DIBENE, JOSEPH TED II;HARTKE, DAVID |
分类号 |
H05K1/11;G06F1/18;H01R4/64;H05K1/02;H05K1/14;H05K3/36;H05K7/10;H05K7/14;H05K7/20;(IPC1-7):H05K1/14;H01R12/04 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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