Metal stud array packaging

摘要

A metal stud array packaging structure has a die pad with a die attached on it. A plurality of metal studs is located around the die pad. A metal heat dissipating ring is selectively located outside the metal studs. The metal heat dissipating ring is connected to the die pad. The die, the die pad, and one end of each metal stud are enclosed by an insulating material. The enclosed ends of the metal studs are electrically connected to bonding pads of the die. The insulating material exposes a bottom surface of the die pad. Moreover, both ends of each metal stud and both surfaces of the metal heat dissipating ring have plated layers.