| 摘要 |
PCT No. PCT/JP96/01348 Sec. 371 Date Nov. 20, 1997 Sec. 102(e) Date Nov. 20, 1997 PCT Filed May 22, 1996 PCT Pub. No. WO96/37917 PCT Pub. Date Nov. 28, 1996Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) covering the circuit board, wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly. |
