发明名称 Mounting arrangement for multilayer electronic part
摘要 A chip capacitor includes a multilayer body composed of a plurality of stacked sheet layers made of ceramics; capacitor electrodes and via hole electrodes disposed inside the multilayer body; and outer electrodes formed on only main surfaces of the multilayer body such that they are electrically connected to the capacitor electrodes via the via hole electrodes. Some of the capacitor electrodes are electrically connected by the via hole electrodes, and the other capacitor electrodes are electrically connected by other via hole electrodes.
申请公布号 US2001000986(A1) 申请公布日期 2001.05.10
申请号 US20010757959 申请日期 2001.01.10
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAI NORIO
分类号 H01F41/04;H01G4/232;H01G4/30;H03H7/01;(IPC1-7):H01G9/00 主分类号 H01F41/04
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