发明名称 |
METHOD FABRICATING A LAMINATED PRINTED CIRCUIT BOARD |
摘要 |
Method and apparatus of fabricating a core laminate Printed Circuit Board structure with highly planar external surfaces is provided. A pre-formed flat material including a first resinous sub-material and a second carrier sub-material is used to planarize external surfaces. During lamination, uniform pressure is applied to the pre-formed flat sheet which covers the upper surface of the printed circuit. The resinous material of the first sub-material flows to fill the crevices, vias, etc. of the upper surface of the PCB. Moreover, due to the uniform pressure on the pre-formed flat sheet, the resinous first sub-material is planarized. This planarized surface provides a suitable base substrate for a thin film multilayer build-up structure and that provides electrical connections between the thin film top layers and the Printed Circuit Board - style core layers. |
申请公布号 |
WO0133925(A1) |
申请公布日期 |
2001.05.10 |
申请号 |
WO2000IB01725 |
申请日期 |
2000.11.06 |
申请人 |
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC);CIMULEC;BEYNE, ERIC;LECHLEITER, FRANCOIS |
发明人 |
BEYNE, ERIC;LECHLEITER, FRANCOIS |
分类号 |
H01L21/48;H01L23/498;H05K3/02;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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