Solid electrolytic capacitor

摘要

A solid electrolytic capacitor of the present invention is produced by connecting a solid electrolytic capacitor element with a lead frame after plating the lead frame with copper and then roughening the surface thereof, and then by molding the solid electrolytic capacitor element and lead frame with an encapsulating resin possessing a thermal expansion coefficient that is near the thermal expansion coefficient of the lead frame. The solid electrolytic capacitor thus produced shows excellent solderability and can withstand a thermal shock encountered at the time of soldering when the solid electrolytic capacitor is mounted on a circuit board. Accordingly, a solid electrolytic capacitor that ensures excellent reliability after being mounted on a circuit board is obtained. In addition, by coating the terminals of the solid electrolytic capacitor with protective plating after resin molding, the solid electrolytic capacitor realizes long shelf life and also assures excellent reliability after being mounted on a circuit board.