发明名称 |
Thermoelectric element and thermoelectric cooling or heating device provided with the same |
摘要 |
A thermoelectric element (1) comprises a partitioning plate (2) having electrical insulating properties; equal numbers of p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B) fixed to the partitioning plate (2) in a state in which they pass through the partitioning plate (2); flat copper electrodes (4) fixed to upper sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B); and T-shaped copper electrodes (5) fixed to lower sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B). Lower portions protruding from the lower surface of the partitioning plate (2) are accommodated within a cooling vessel and are cooled directly by a coolant or air.
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申请公布号 |
US6226994(B1) |
申请公布日期 |
2001.05.08 |
申请号 |
US19990254122 |
申请日期 |
1999.03.01 |
申请人 |
SEL APPLICATION CO., LTD.;MORIX CO., LTD. |
发明人 |
YAMADA KAZUKIYO;MORINO ISAO |
分类号 |
F25B21/02;H01L35/30;H01L35/32;(IPC1-7):F25B21/02 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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