| 摘要 |
Methods and apparatus for fabricating stacked capacitor structures, which include barrier layers, are disclosed. According to one aspect of the present invention, a method for reducing outdiffusion within an integrated circuit includes forming a gate oxide layer over a substrate, and further forming a silicon plug over a portion of the gate oxide layer. A silicon dioxide layer is then formed over the gate oxide layer, and is arranged around the silicon plug. A first barrier film is formed over the silicon plug, and a dielectric layer is formed over the silicon dioxide layer. In one embodiment, forming the first barrier film includes forming a first oxide layer over the silicon plug, nitridizing the first oxide layer, and etching the nitridized first oxide layer.
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