发明名称 Method of fabricating shallow trench isolation structure
摘要 A method of fabricating a shallow trench isolation structure is described. A mask layer is formed on the substrate. The mask layer and the substrate are patterned to form trenches in the substrate. The trenches comprise a smallest trench. A first isolation layer is formed on the mask layer to fill partially the trenches. A densification step is performed. A second isolation layer is formed on the first isolation layer to fill completely the trench. The first isolation layer and the second isolation layer are removed until the mask layer is exposed. The mask layer is removed.
申请公布号 US6228742(B1) 申请公布日期 2001.05.08
申请号 US19990264692 申请日期 1999.03.08
申请人 UNITED MICROELECTRONICS CORP. 发明人 YEW TRI-RUNG;LUR WATER;YANG GWO-SHII
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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