| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the throughput of a work without detecting the size, shape, and position of the work. SOLUTION: A wafer 82 is fitted to a frame 84 at a specific position through the fitting jig 88, and, after an image of the wafer 82 is picked up according to position information showing the fitting position of the wafer 82, the wafer is aligned and cut. The wafer 82 is fitted on the frame at the determined position by the fitting jig 88, so the image of the wafer 82 is picked up at the position and the wafer is cut after aligned.</p> |
