| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate plating apparatus to prevent a plating solution from turning around to the rear side of a substrate. SOLUTION: The substrate plating apparatus to plate the work face WF of a wafer W comprises a holding mechanism 1 to hold the wafer W, a feed port 28 to feed the plating solution to the work face WF of the wafer W held by the holding mechanism 1, an anode 23 disposed above the wafer W held by the holding mechanism 1, a support member 5 having a cathode 8 electrically connected to the wafer W held by the holding mechanism 1 on the lower side, further comprising a cut groove 51 below and on the inner circumferential side of the cathode electrode 8 and supporting an outer circumferential end part of the work face WF of the wafer W held by the holding mechanism 1, and a power supply unit 40 to feed the power so as to run the current between the anode 23 and the cathode 8.
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