发明名称 Ferroelectric random access memory device and fabrication method therefor
摘要 A ferroelectric random access memory (FRAM) device, and a fabrication method therefor, includes seed layers above and below a ferroelectric layer. The seed layers formed above and below faces of the ferroelectric layer can prevent an imprint phenomenon from being generated in a ferroelectric capacitor by making the characteristics of the upper and lower interfaces of the ferroelectric layer be the same. This is accomplished by providing upper and lower seed layers that are crystallized prior to the ferroelectric layer during a thermal treatment. This results in crystallization occurring from the upper and lower faces to the center of the ferroelectric layer, making the characteristics of the upper and lower interfaces of the ferroelectric layer the same, thereby improving ferroelectric capacitor characteristics.
申请公布号 US6229166(B1) 申请公布日期 2001.05.08
申请号 US19980198374 申请日期 1998.11.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM BYUNG-HEE;PARK HONG-BAE
分类号 H01L27/10;H01L21/02;H01L21/314;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;H01L27/115;(IPC1-7):H01L29/76 主分类号 H01L27/10
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