| 摘要 |
A ceramic substrate for an integrated circuit package comprising a mixture of MgO and a glass, where the material has a coefficient of expansion greater than about 5 PPM/° C. and less than about 16 PPM/° C. In one embodiment, the material includes a low temperature composition glass which sinters in the range of about 600-1400° C., and is provided with metal traces selected from the group consisting essentially of copper, silver, gold and alloys thereof. The material preferably includes 30-80 percent MgO by weight, and the low temperature composition glass sinters in the range of about 900-1100° C. In another embodiment, the material includes a high temperature composition glass which sinters in the range of 1400-1800° C., and wherein the coefficient of expansion of the material is greater than about 8 PPM/° C. and less than about 16 PPM/° C. In this other embodiment, metal traces selected from the group consisting essentially of molybdenum, tungsten, molymanganese, and alloys thereof are provided, and the material includes 50-99 percent MgO by weight and, more preferably, 85-92 percent MgO by weight.
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