Temperature controlled chemical mechanical polishing method and apparatus

摘要

Apparatus and method for producing more uniformly polished wafers using chemical mechanical polishing (CMP). The present invention recognizes that wafer temperature is important in achieving uniform polishing. Mechanisms are disclosed for regulating carrier and carrier plate temperatures and thereby regulating the temperature of an attached wafer. Mechanisms are also disclosed that insulate a wafer, at least to some extent, from undesired heat sinks or heat sources.