| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting sealing resin composition excellent in filling property and workability, having little wearing during molding processing step, suitable for transfer molding and excellent in the appearance of the cured resin product, and a semiconductor device using the same. SOLUTION: The sealing resin composition comprises (A) 30-90 wt.% of an inorganic filler having a maximum particle diameter of at most 300μm and an average particle diameter of 0.05-70μm, (B) 0.01-5 wt.% of a nonpolar organic solvent having permittivity at 20 deg.C of less than 5.0 and boiling point of 80-160 deg.C, and (C) 5-50 wt.% of a thermosetting resin as indispensable components, based on the total weight of the resin composition. The semiconducting device comprises a semiconductor chip sealed in the resin composition by the cured sealing resin composition.
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