| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device carrying tape wherewith semiconductor devices can be taken out easily from the inside of dents thereof and the time required for adjusting a taping equipment in accordance with changes of the kinds of semiconductor can be reduced. SOLUTION: A pair of dents 33A are provided at a carrier tape 30A, projecting oppositely in the breadthwise direction from the peripheral side walls 31s of a dent 31A, tips of a pair of tweezers 36 are inserted into the dents 33A, and a piece of semiconductor device 6A is taken out. The length W of an opening formed in the breadthwise direction by the dent 31A and the dents 33A is made the same as the length formed in tapes 30B and 30C respectively having dents 31B and 31C in different sizez, and adjustment of a gap between a pair of guide rails 7, 7 required in accordance with changes of the kinds of semiconductor devices 6A, 6B and 6C becomes unnecessary.
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